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Circuit board solder joints reflowed by the vapor phase of a material can be cooled at a beneficially controlled rate by spraying the boards with the same working fluid in its liquid state.
English (United States)
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Solder Cooling Technique
Circuit board solder joints reflowed by the vapor phase of a material can be
cooled at a beneficially controlled rate by spraying the boards with the same
working fluid in its liquid state.
In the drawing, multilayer interconnection boards 1 with surface mount
components thereon are moved by conveyor 7 on rail 8 through pre-heat station
2 to vapor phase reflow station 3. At this station, the boards are stopped for a
period sufficient for the heat of a vaporized fluorocarbon liquid such as flourinert
at 215 C to heat and reflow the previously solder coated joints. The board is then
moved to spray station 4 where the fluorinert liquid at room temperature is
sprayed from nozzle 5 on the underside of the board to cool the reflowed joints.
The cool liquid and its transformation to a gas enhances the board cooling. By
regulating the liquid spray, the cooling of the board can be controlled to provide
an optimum cooling rate for the solder through its critical solidification range.
Condensed vapor can be returned to the liquid supply 6 at the tank bottom for