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Solder Cooling Technique Disclosure Number: IPCOM000037879D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-30

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Vittone, JM Yetter, LR [+details]


Circuit board solder joints reflowed by the vapor phase of a material can be cooled at a beneficially controlled rate by spraying the boards with the same working fluid in its liquid state.