Browse Prior Art Database

Solder Cooling Technique

IP.com Disclosure Number: IPCOM000037879D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-30

Publishing Venue

IBM

Related People

Authors:
Vittone, JM Yetter, LR [+details]

Abstract

Circuit board solder joints reflowed by the vapor phase of a material can be cooled at a beneficially controlled rate by spraying the boards with the same working fluid in its liquid state.