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Solder Ring Retention Clip Disclosure Number: IPCOM000037880D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-30

Publishing Venue


Related People

Bongiorno, PJ Chan, WMR Zimmer, JW [+details]


Solder rings can be retained temporarily on staggered connector pins prior to reflow by using a U-shaped spring clip with angularly disposed slots that each accept a plurality of ringed pins.