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Solder rings can be retained temporarily on staggered connector pins prior to reflow by using a U-shaped spring clip with angularly disposed slots that each accept a plurality of ringed pins.
English (United States)
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Solder Ring Retention Clip
Solder rings can be retained temporarily on staggered connector pins prior to
reflow by using a U-shaped spring clip with angularly disposed slots that each
accept a plurality of ringed pins.
In the figures, connector 1, shown in phantom, has three rows of pins 2
extending from its top surface. The pins in one row are offset or staggered with
respect to pins in the other rows. Preformed solder rings (not shown) are placed
over each pin on the top surface and retained in place by sliding U-shaped
slotted clip 3 of thin, resilient material over the rings and connector bottom. Slots
4 are disposed at an acute angle relative to the connector axis and accept one
pin from each row to retain the respective rings adjacent to the connector. The
connector is then inverted, the pins inserted in a printed wiring board, and the clip
removed. The solder rings can now be reflowed.