Browse Prior Art Database

Solder Ring Retention Clip

IP.com Disclosure Number: IPCOM000037880D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-30

Publishing Venue

IBM

Related People

Authors:
Bongiorno, PJ Chan, WMR Zimmer, JW [+details]

Abstract

Solder rings can be retained temporarily on staggered connector pins prior to reflow by using a U-shaped spring clip with angularly disposed slots that each accept a plurality of ringed pins.