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Cover tape used in the packaging of semiconductor components for automatic pick-place tools can be removed without tearing by using a crowned roller for the pull-back mechanism.
English (United States)
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Device to Prevent Tape Tearing
Cover tape used in the packaging of semiconductor components for
automatic pick-place tools can be removed without tearing by using a crowned
roller for the pull-back mechanism.
Components to be automatically placed on printed circuit boards are carried
in a tape package which is wound on reels. The tape package is comprised of a
two-piece tape assembly: one piece being an embossed tape carrier into which
the components are placed, and the other piece being a cover tape which is heat
sealed to the carrier tape and covers the embossed pockets thus sealing in the
component. The automatic pick/place tool feeds these components to a
placement transfer head wherein the feeding mechanism must pull the cover
tape off the carrier tape to expose the components for subsequent placement.
These tape pull mechanisms are currently sharp metal wedges which can tear
This tape tearing problem can be solved by replacing the sharp metal wedge
pull-back bracket with a crowned roller. The cover tape is now removed by
rolling the tape over the crowned roller.