Browse Prior Art Database

Tape Void Filler

IP.com Disclosure Number: IPCOM000037928D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-31

Publishing Venue

IBM

Related People

Authors:
Guttler, JW Moskowitz, PA [+details]

Abstract

During the TAB (tape automated bonding) manufacturing process, centers of individual frames of tape must be removed for sampling. For instance, after inner lead bonding, centers of frames of tape may be removed to allow inspection and pull testing of the inner lead bonds. The result is that a large hole or void is left in the tape. If the void is allowed to remain in the tape, the tape is seriously weakened and difficulties may be encountered in subsequent manufacturing steps, such as encapsulation, or testing. The tape may not advance properly. It may slide off sprocket wheels and jam tools.