Elimination of Surface Conductivity of Polyimide
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-31
In metal-ceramic polymer structures of the type used for packaging, via holes are produced by Ar ion-beam etching. However, this process can cause resputtering of metal atoms to the surface of the polymer (polyimide) layer and the formation of a carbon-rich layer on the surface of the polymer. This causes the polymer surface to become conducting, thereby destroying the desired insulating properties of the polyimide. Two methods are described to remove this surface conductive layer.