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Thermostatic Control of Contact Heating Thermode for Temperature Uniformity

IP.com Disclosure Number: IPCOM000037934D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-31

Publishing Venue

IBM

Related People

Authors:
Chalco, P Khandros, I Rohr, R [+details]

Abstract

The tooling disclosed uses a bimetallic or memory material (10) to insure uniform heating of each lead (12) on "J" leaded Surface Mounted components (14) being soldered to boards (20). Non-uniform heating usually occurs because the leads are not perfectly planar causing the thermode or hot bar not to contact all the leads thus producing a poor solder joint on those leads with poor thermode contact.