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Module Assembly Process Disclosure Number: IPCOM000037970D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-31

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Ameen, JG Clancy, PB Smey, SL [+details]


The following process encapsulates a standard module assembly (SMA) to provide a hermetic seal to protect the SMA against the environment in which the device is to be used.