Browse Prior Art Database

Module Assembly Process

IP.com Disclosure Number: IPCOM000037970D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-31

Publishing Venue

IBM

Related People

Authors:
Ameen, JG Clancy, PB Smey, SL [+details]

Abstract

The following process encapsulates a standard module assembly (SMA) to provide a hermetic seal to protect the SMA against the environment in which the device is to be used.