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The following process encapsulates a standard module assembly (SMA) to provide a hermetic seal to protect the SMA against the environment in which the device is to be used.
English (United States)
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Module Assembly Process
The following process encapsulates a standard module assembly (SMA) to
provide a hermetic seal to protect the SMA against the environment in which the
device is to be used.
As shown in the figure, chip 1 is joined to substrate 2 and Sylgard 3 (*) is
dispensed to cover the area under and on top of the chip. The Sylgard is then
An aluminum plate 4 is placed on the Sylgard directly over the chip. A weight
of up to 4 lbs. may be added on top of the plate to hold it in place if necessary.
Dispense Scotchcast 5 (**) over the remaining area of the substrate not
covered by the plate. Cure the Scotchcast.
Because of the Sylgard's presence, the Scotchcast will be prevented from
wicking under the plate in the vicinity of the chip. The aluminum plate acts as a
heat fin facilitating heat removal. Only low stress is placed on the chip during
thermocycling if the aluminum plate is kept thin. If necessary, non-conducting
standoffs, e.g., epoxy beads, may be incorporated into the aluminum plate to
guarantee planarity if thin foil aluminum is used. * Trademark of the Dow Corning
Corp. ** Trademark of the 3M Co.