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Decal Module Cap Bonding Method

IP.com Disclosure Number: IPCOM000037971D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-31

Publishing Venue

IBM

Related People

Authors:
Kresge, JS Lamb, CR [+details]

Abstract

A decal module is constructed by bonding the decal and a chip to a metal cap. The following information relates to a method of accomplishing this bonding, and in addition achieves electrical isolation, low thermal path between the chip and the cap (the cap also acts as a heat sink) and material compatibility.