Decal Module Cap Bonding Method
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-31
A decal module is constructed by bonding the decal and a chip to a metal cap. The following information relates to a method of accomplishing this bonding, and in addition achieves electrical isolation, low thermal path between the chip and the cap (the cap also acts as a heat sink) and material compatibility.