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Grounding Strap for MC Packages

IP.com Disclosure Number: IPCOM000037986D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-31

Publishing Venue

IBM

Related People

Authors:
Engle, SR English, JJ Roody, AG Storr, WR [+details]

Abstract

Disclosed is a strap (10) made from a conductive spring material. The one end of the strap is punched out in a star-like fashion (11) such that insertion over a module pin is aided, but removal is prohibited by the fingers biting into the pin. The top of the strap is serrated to allow the strap to bite into the aluminum cap.