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Ultrasonic Bonding Technique

IP.com Disclosure Number: IPCOM000037987D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-31

Publishing Venue

IBM

Related People

Authors:
Carden, GR Hall, DJ Holland, SP Phelps, DW Starr, SG [+details]

Abstract

Disclosed is a technique for ultrasonic bonding wire or ribbon material onto thin or low adhesion metallurgical layers.