Copper Cleaning And Treatment Solution
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-31
Disclosed is the formulation of a copper cleaning and treatment solution effective in removing organic residue and oxide from the surface of copper prior to electroless or electrolytic plating. This formulation is particularly useful for thin base copper layers (e.g., sputtered copper films, 5 micron copper foil) and pattern plating applications.