Browse Prior Art Database

Enhanced Chip Encapsulant

IP.com Disclosure Number: IPCOM000037989D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-31

Publishing Venue

IBM

Related People

Authors:
Ameen, JG Funari, J Sissenstein, DW, Jr Smey, SL [+details]

Abstract

At present, there are two encapsulants for use on chips (the so called "glob-top" application). One is a silicone for reduced stress, the other is an epoxy for solvent resistance. This disclosure describes one encapsulant that has both properties.