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Enhanced Chip Encapsulant Disclosure Number: IPCOM000037989D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-31

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Related People

Ameen, JG Funari, J Sissenstein, DW, Jr Smey, SL [+details]


At present, there are two encapsulants for use on chips (the so called "glob-top" application). One is a silicone for reduced stress, the other is an epoxy for solvent resistance. This disclosure describes one encapsulant that has both properties.