Browse Prior Art Database

Use of a Composite Metal Pad for Wirebond Connection to the Copper Core of a Metal Core Substrate Circuit Board

IP.com Disclosure Number: IPCOM000037993D
Original Publication Date: 1989-Sep-01
Included in the Prior Art Database: 2005-Jan-31

Publishing Venue

IBM

Related People

Authors:
Chiles, TH [+details]

Abstract

The present invention utilizes a composite metal wirebond pad for the purpose of connection to the ground plane on a copper core thermal substrate board. As shown in the single figure, a copper core heat sink 10 is provided which has attached thereon a dielectric 12, carrying a tri-layer of a copper 14, nickel 16 and gold 18 or other wirebondable metallurgy. A bond pad 20, which is a pad of aluminum 22 claded onto a copper base 24, is attached by solder 26 onto the heat sink 10 through a window in the dielectric 12. The pad 20 is cut or stamped from commercially available aluminum claded copper sheets.