Browse Prior Art Database

Sleeve Cap for Edge-Connected Modules

IP.com Disclosure Number: IPCOM000038050D
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-31

Publishing Venue

IBM

Related People

Authors:
Gow, J Hoffman, HS Karner, FA [+details]

Abstract

A low cost sleeve cap is used to contain edge-connected semiconductor modules. Module insertion into the sleeve cap and application of standard materials for protecting and encapsulating modules and micro circuit chips is performed inexpensively.