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Sleeve Cap for Edge-Connected Modules Disclosure Number: IPCOM000038050D
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-31

Publishing Venue


Related People

Gow, J Hoffman, HS Karner, FA [+details]


A low cost sleeve cap is used to contain edge-connected semiconductor modules. Module insertion into the sleeve cap and application of standard materials for protecting and encapsulating modules and micro circuit chips is performed inexpensively.