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Selective Connection of Circuit Elements in Multilayer Ceramic Structure

IP.com Disclosure Number: IPCOM000038051D
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-31

Publishing Venue

IBM

Related People

Authors:
Gow, J Hoffman, HS Karner, FA [+details]

Abstract

To permit connection of selected lines within a multilayer ceramic (MLC) circuit, special openings are provided in a top ceramic layer exposing solderable line ends. Selected connection is made by placing solder balls on exposed ends of the lines to be connected and then reflowing the solder.