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Browse Prior Art Database

Cable Attached Surface Mount Package

IP.com Disclosure Number: IPCOM000038060D
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-31

Publishing Venue

IBM

Related People

Authors:
Capwell, RJ Chapin, RW Leadbeater, RG [+details]

Abstract

Disclosed is a surface mount package that utilizes metalized ceramic and flex circuit cabling. This package takes advantage of present ceramic "C4" chip mounting and flex circuit attributes such as thermal flexibility, mounting configuration, and circuit design. The ceramic substrate's thermal properties are better utilized by the inverted mounting. Other benefits include increased number of circuit lines available per given area and population of both sides of circuit board.