Cable Attached Surface Mount Package
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-31
Disclosed is a surface mount package that utilizes metalized ceramic and flex circuit cabling. This package takes advantage of present ceramic "C4" chip mounting and flex circuit attributes such as thermal flexibility, mounting configuration, and circuit design. The ceramic substrate's thermal properties are better utilized by the inverted mounting. Other benefits include increased number of circuit lines available per given area and population of both sides of circuit board.