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Copper Paste Formulations for Multilayer Ceramic (MLC) Applications

IP.com Disclosure Number: IPCOM000038064D
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-31

Publishing Venue

IBM

Related People

Authors:
Hibler, LB McCleery, CF Patterson, T [+details]

Abstract

1) A copper paste composed of the following ingredients provides good feature resolution and pattern adhesion when screened on ceramic sheets: 81 - 87 % Copper Powder 11 - 17 % Isobutyrate and Ethyl Cellulose 0 - 1 % Detergent 0 - 1 % Castor Oil Polymer 2) The following copper paste, which contains a glass frit, enhances adhesion of the copper paste to the ceramic - (via holes and patterns): 81 - 85 % Blend of Copper Powder and Glass Frit (max. of 10 % frit, by volume, in blend) 13 - 17 % Isobutyrate and Ethyl Cellulose 0 - 1 % Detergent 0 - 1 % Castor Oil Polymer