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Metallurgy for I/O Pin Attachment

IP.com Disclosure Number: IPCOM000038065D
Original Publication Date: 1989-Oct-01
Included in the Prior Art Database: 2005-Jan-31

Publishing Venue

IBM

Related People

Authors:
Palmateer, PH Shih, DY [+details]

Abstract

Nickel/gold plated Kovar (1) or Invar (2) I/O pins can be joined to substrates utilizing low tin solder alloys (5%-10% tin) with the following metallurgy evaporated on the substrate surface: o Ceramic substrate - 500 Angstroms Zr, 4 Microns Ni, 5000 Angstroms Au or 500 Angstroms Ti, 4 Microns Ni, 5000 Angstroms Au. o Polyimide coated ceramic - 500 Angstroms Cr, 4 Microns Ni, 5000 Angstroms Au.