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A pinhead has been designed for use in semiconductor devices which minimizes the stress transmitted to the braze joint and reduces the amount of braze material required in the joint.
English (United States)
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Composite Pinhead Design
A pinhead has been designed for use in semiconductor devices which
minimizes the stress transmitted to the braze joint and reduces the amount of
braze material required in the joint.
Pins used on substrates 1 (Fig. 1) have been designed with a thick "nailhead"
shape 2 to minimize stress transmitted to the braze from pin pulling and/or
bending. This reduces the incidence of braze fails in subsequent processing and
results in an absence of braze or socket failures in the pin pull test. The fillet 3
consumes a substantial amount of braze material. Other designs use a tapered
pinhead 4 (Fig. 2) which consumes 20-40% less braze material for the fillet 3.
It is proposed that a composite taperhead pin be used which would include a
thick nailhead section 5 (Fig. 3) terminating in a tapered section 6 which would
be brazed to the substrate 1. The new design would provide the strength
inherent with the thick nailhead and yet retain the tapered head pin's advantage
of requiring less braze material to attach the tapered head to the substrate.