Process for Removing Some Thermally Conductive Adhesive Films from Chips After Heat Sinks Had Been Attached
Original Publication Date: 1989-Nov-01
Included in the Prior Art Database: 2005-Jan-31
Semiconductor chips 1 are often cooled by the attachment of heat sinks 2 to the backs of the chips. It is often desirable to be able to completely remove the heat sink and adhesive that was either permanently or temporarily attached. This disclosure solves the problems of having a procedure for the complete removal of some adhesives used for heat sink attachment, from the damage or contaminate semiconductor packages.