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Process for Removing Some Thermally Conductive Adhesive Films from Chips After Heat Sinks Had Been Attached

IP.com Disclosure Number: IPCOM000038147D
Original Publication Date: 1989-Nov-01
Included in the Prior Art Database: 2005-Jan-31

Publishing Venue

IBM

Related People

Authors:
Edwards, DL Yakubowski, C [+details]

Abstract

Semiconductor chips 1 are often cooled by the attachment of heat sinks 2 to the backs of the chips. It is often desirable to be able to completely remove the heat sink and adhesive that was either permanently or temporarily attached. This disclosure solves the problems of having a procedure for the complete removal of some adhesives used for heat sink attachment, from the damage or contaminate semiconductor packages.