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Two Thermally Conductive Adhesives for Heat Sink Attachment that are Completely Removable

IP.com Disclosure Number: IPCOM000038148D
Original Publication Date: 1989-Nov-01
Included in the Prior Art Database: 2005-Jan-31

Publishing Venue

IBM

Related People

Authors:
Booth, RB Edwards, DL Rittenberry, JG Yakubowski, C [+details]

Abstract

Disclosed are two materials for the temporary attachment of heat sinks to chips for high performance cooling, that are stable in a boiling fluorocarbon environment and completely removable.