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Disclosed are two materials for the temporary attachment of heat sinks to chips for high performance cooling, that are stable in a boiling fluorocarbon environment and completely removable.
English (United States)
This text was extracted from a PDF file.
This is the abbreviated version, containing approximately
87% of the total text.
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Two Thermally Conductive Adhesives for Heat Sink Attachment that are
Disclosed are two materials for the temporary attachment of heat sinks to
chips for high performance cooling, that are stable in a boiling fluorocarbon
environment and completely removable.
Photoresist may be used to attach heat sinks to chips. It is commercially
available in thin sheets which contribute to a very controllable, yet low thermal
resistance. For ease of application to an array of chips, the photoresist may be
exposed and developed, so that all that is left is an array of discrete adhesive
shapes. To simplify placing these shapes on all chips simultaneously, the
shapes may be located on the chip pitch. To vary the thermal performance of
different chip sites, different material thickness or shapes may be used. The
material is also stable in a boiling fluorocarbon environment. It is also completely
removable with common industrial solvents.
An adhesive compound of polybuthdiene, filled with aluminum nitride, and
cured with dicumyl peroxide, may also be used for the temporary attachment of
heat sinks to chips. After this material is sandwiched between the chips and the
heat sinks, the assembly is cured at an elevated temperature. It forms a good
mechanical and thermal bond that is stable in a boiling flurorcarbon environment.
After soaking the assembly in an appropriate solvent bath, the heat sinks and
adhesive are completely removable. The thermal conductivity and...