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Off-Normal Ion Etching in Hole Filling Process

IP.com Disclosure Number: IPCOM000038168D
Original Publication Date: 1989-Dec-01
Included in the Prior Art Database: 2005-Jan-31

Publishing Venue

IBM

Related People

Authors:
Daubenspeck, TH Dreves, RF [+details]

Abstract

Off-normal ion impingement during etch planarization eliminates vertical enlargement of voids formed in conformal coatings used to fill holes.