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Sacrificial Material for Planarization Disclosure Number: IPCOM000038171D
Original Publication Date: 1989-Dec-01
Included in the Prior Art Database: 2005-Jan-31

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Related People

Hallock, DP Luce, SE Pennington, SL [+details]


To avoid high temperature processing or processing in more than one tool, a sacrificial material having a low melting point, e.g. boron oxide (B2O3), is deposited in a tool having both chemical vapor deposition (CVD) and reactive ion etching (RIE) processes available within a controlled environment.