Browse Prior Art Database

Double Chip Package

IP.com Disclosure Number: IPCOM000038172D
Original Publication Date: 1989-Dec-01
Included in the Prior Art Database: 2005-Jan-31

Publishing Venue

IBM

Related People

Authors:
Bertin, CL Kalter, HL Kelly, GA, Jr [+details]

Abstract

To make a package of reduced size and to eliminate one level of packaging, two semiconductor chips are first bonded together back-to-back with a thermally conductive cement. A polymide strip is placed over the front surface of each chip, covering the chip except for the chip bond pads. A copper alloy lead frame is placed over the polyimide and is later formed into leads that allow mechanical and electrical connection to a board level of electronic instrument assembly. Connections between the chip bond pads and the lead frame are made by wire bonding. The package is completed by molding in an opaque plastic.