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Process for Improved Photoresist to Polyimide Adhesion

IP.com Disclosure Number: IPCOM000038173D
Original Publication Date: 1989-Dec-01
Included in the Prior Art Database: 2005-Jan-31

Publishing Venue

IBM

Related People

Authors:
O'Connor, JL Previtti-Kelly, RA [+details]

Abstract

An amino-silane (A-1100) plus methanol solution is applied to the surface of cured polyimide and brought to an elevated temperature in a nitrogen environment prior to application of a novolak resin type of photoresist, thus achieving improved adhesion of the photoresist on polyimide. Improved adhesion is especially necessary when very small photoresist features are created which must adhere throughout a process of etching through a polyimide layer.