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Precured Low Dielectric Materials for Use in High Performance Boards

IP.com Disclosure Number: IPCOM000038183D
Original Publication Date: 1989-Dec-01
Included in the Prior Art Database: 2005-Jan-31

Publishing Venue

IBM

Related People

Authors:
Samuelson, CE [+details]

Abstract

Disclosed is a new concept of using pre-cured low dielectric materials between conventional FR-4 type power and signal planes.