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Disclosed is a new concept of using pre-cured low dielectric materials between conventional FR-4 type power and signal planes.
English (United States)
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Precured Low Dielectric Materials for Use in High Performance Boards
Disclosed is a new concept of using pre-cured low dielectric materials
between conventional FR-4 type power and signal planes.
The high temperature precured low dielectric materials comprise PTFE (such
as Teflon (E.I. DuPont)) and woven glass cloth. These materials are laminated
at high temperatures (>650 degrees F) and then placed in a composite board.
Composite boards can be manufactured with dielectric constants down to 2.5
vs. 4.0 for conventional FR-4 type composites.
The resulting composites are dimensionally stable due mainly to the glass
reinforcement and the precuring of the low dielectric constant layers.
A typical schematic diagram of a composite board containing the low
dielectric constant layers between power and signal layers is shown below.