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Low Cost Silicon/Thin Film Wire Bonding Fanout Base

IP.com Disclosure Number: IPCOM000038187D
Original Publication Date: 1989-Dec-01
Included in the Prior Art Database: 2005-Jan-31

Publishing Venue

IBM

Related People

Authors:
Favata, AF Jacobs, SL Nihal, P Schnurmann, HD [+details]

Abstract

It is proposed to use Si wafers and thin film processes to make space transformers for low cost packaging of semiconductor devices. The method uses the wafers and processes instead of ceramic or decal type carriers with thin films.