Browse Prior Art Database

Radiation Cured Substrate for Circuit Cards

IP.com Disclosure Number: IPCOM000038189D
Original Publication Date: 1989-Dec-01
Included in the Prior Art Database: 2005-Jan-31

Publishing Venue

IBM

Related People

Authors:
Aulick, LO Franey, TE Leslie, GG Schum, VJ Welch, JT, III Zimmer, MK [+details]

Abstract

Disclosed is a substrate for circuit cards. The substrate is made using a highly filled Ultra Violet light or Electron Beam curable resin. A typical filler package is a blend of reinforcing and non-reinforcing fillers. Typically, glass fibers and mica or glass fibers and glass beads are used. The highly filled substrate presents novel property and application advantages unattainable with either epoxy board or injection moldable thermoplastic. These advantages follow from the fact that uncured resins are typically low molecular weight, low viscosity liquids. Hence, they can be filled to very high levels (>70%) to achieve properties known to be important to surface mount technology, such as low thermal expansion, high stiffness and high temperature resistance.