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Disclosed is an edge alignment mark design to improve the alignment accuracy for devices where the edge-to-edge alignment between levels is critical.
English (United States)
This text was extracted from a PDF file.
This is the abbreviated version, containing approximately
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Edge Alignment and Edge Vernier Alignment Mark for Thin Film Head
Disclosed is an edge alignment mark design to improve the alignment
accuracy for devices where the edge-to-edge alignment between levels is critical.
In the fabrication of the devices using lithographic technique, the center-to-
center alignment between device levels is normally used. This type of alignment
works very well for most of the device levels. However, there are situations
where edge-to-edge relationship across the levels are important, that better
control of this edge-to-edge alignment will lead to device performance
improvement as well as yield improvement. With conventional center-to-center
alignment, the misalignment between the critical edges is equal to the sum of the
photo alignment error and the process windage errors in the two corresponding
levels. The windage error arising from the first mask level can be compensated
by the disclosed edge-to-edge alignment mark scheme. The mask alignment
accuracy can be further improved using an edge vernier alignment mark.
An edge alignment mask design is depicted in Fig. 1. Conventional center-to-
center alignment is used in the X direction and edge-to-edge alignment is used in
the Y direction for illustration. Dashed line represents structures in the first level.
Solid line depicts the alignment mark design on the second level. Cusps shape
geometry on the mask is used for the coarse alignment. Alignment is made by
placing the das...