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Back Side Cooling for Printed Circuit Board

IP.com Disclosure Number: IPCOM000038314D
Original Publication Date: 1989-Dec-01
Included in the Prior Art Database: 2005-Jan-31

Publishing Venue

IBM

Related People

Authors:
Keller, CJ [+details]

Abstract

The thermal resistance between the back of a printed circuit board (PCB) and the main stream of the cooling air can be improved by providing a metal back cover that redirects the flow of cooling air while suppling physical protection and structural stiffening.