Browse Prior Art Database

Integral Seal Vacuum Lamination Frames

IP.com Disclosure Number: IPCOM000038330D
Original Publication Date: 1987-Jan-01
Included in the Prior Art Database: 2005-Jan-31

Publishing Venue

IBM

Related People

Authors:
Andresakis, JA Conn, RB Jephson, JR Sylvester, JF [+details]

Abstract

During the lamination of copper clad epoxy/glass circuit boards, an epoxy resin must flow to form a homogeneous, void-free laminate. Providing a vacuum around the product during the lamination cycle helps to evacuate all air from between the layers of product and remove volatiles from the product as they are released during lamination. This vacuum lamination minimizes laminate void problems by using a vacuum frame consisting of an aluminum frame with a rubber gasket. The frame is constructed and works, as described, in the following. 2 p. An integral seal vacuum lamination frame consists of a one-piece silicon rubber gasket 1 (Fig. 1) which is stretched over an aluminum frame 2. Tabs 3 on the inside of gasket 1 fit into grooves 4 (Section AA) of aluminum frame 2 to prevent the gasket 1 from sagging on the frame 2.