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Flip-Chip With Superconducting Contacts

IP.com Disclosure Number: IPCOM000038334D
Original Publication Date: 1987-Jan-01
Included in the Prior Art Database: 2005-Jan-31

Publishing Venue

IBM

Related People

Authors:
Brady, MJ Davidson, A Frank, DJ [+details]

Abstract

This article relates generally to a method of connecting conductors to superconducting devices and, more particularly, to a method of bonding superconducting contacts on a substrate with those on a superconducting device. Contacts of a superconducting device or chip can be easily and reliably attached to measurement conductors by first forming the conductors and their contact pads on a transparent substrate. A transparent substrate of glass is coated with a thin chromium layer covered by a thicker copper layer. Using photoresist lithography, pads and lines are etched on the substrate to match the contact pads of the superconducting device and to form lines leading to other larger pads beyond the superconducting device area.