Contactless Resistance Measurement by a Combination of E-Beam and Photoemission Methods
Original Publication Date: 1987-Jan-01
Included in the Prior Art Database: 2005-Jan-31
This article is concerned with the contactless measuring of line resistances in circuit packaging, combining E-beam technology and laser-excited photoemission. At present there is a large and steadily growing interest in contactless resistance measurements. One topic in which this is an important problem is the conduction-line testing in packaging technology. Up to now only the measurement of opens and shorts was possible by using contactless E-beam measurement methods. Presently there is no solution for contactless resistance measurements on highly integrated structures. The only approach which currently exists is the measurement of RC-time constants by an E-beam method from which the resistance can be calculated if the capacities of the system are known.