Browse Prior Art Database

Vertical Immersion Solder Machine

IP.com Disclosure Number: IPCOM000038339D
Original Publication Date: 1987-Jan-01
Included in the Prior Art Database: 2005-Jan-31

Publishing Venue

IBM

Related People

Authors:
Kohn, H Sarnacki, FH [+details]

Abstract

Immersion solder is a process in which connectors are attached to a printed circuit board (PCB) by applying solder to the board while the board and solder are immersed in a heated flux bath. A method of accomplishing this process in a vertical machine is described in the following. A PCB 1 to be immersion soldered is loaded in board-loading rack 2 in a vertical position where an overhead conveyor 3 picks up the board 1 and transports it to a flux tank 4 which holds a process heating bath. As the board 1 is lowered into the flux tank 4, it passes a degassing nozzle 5 located below the flux surface 6 where nozzle 5 forces hot process flux through board plated-through holes (PTHs), pushing out air that was trapped in the PTHs.