Browse Prior Art Database

Pin Attachment System for Glass Ceramic

IP.com Disclosure Number: IPCOM000038435D
Original Publication Date: 1987-Jan-01
Included in the Prior Art Database: 2005-Jan-31

Publishing Venue

IBM

Related People

Authors:
Chance, DA [+details]

Abstract

In ceramic packages for LSI (large-scale integration) chips, pads are provided on the package for connection to pins which provide electrical and mechanical connections of the package to external devices. This system solves the problem of providing an excellent electrical connection between a pin for attachment of a chip package to an electrically conductive via which passes through the interior of the packaging substrate. Pads which are composed of metal tend to be mismatched with respect to the substrate's coefficient of thermal expansion (C.T.E.) and that of a metal such as copper, which has a far greater C.T.E. Adhesion of copper pads is not feasible in such circumstances. Here, the conflict is overcome by opening a hole in the center of the pads.