Browse Prior Art Database

Laser Ablation Tool for Clean Products

IP.com Disclosure Number: IPCOM000038441D
Original Publication Date: 1987-Jan-01
Included in the Prior Art Database: 2005-Jan-31

Publishing Venue

IBM

Related People

Authors:
Donelon, JJ Tibbetts, R Wilczynski, J Yeh, JT [+details]

Abstract

Ablation debris can be kept away from substrates by laser ablation in a reduced atmosphere or below the claimed threshold pressure. Threshold pressure for laser ablation of polyimide is 20 mTorr of air or 100 mTorr of He. The laser beam entrance window can be kept free from ablation products with a window gas curtain with pressure higher than 1 Torr. This laser etch tool concept keeps both the beam window and substrate free from ablation product contamination. Recently, there has been great interest and development of using laser ablation for etching polymers and metal compounds. In such processes, the ablation etch products are ejected from the irradiated area with translational speed in the order of 105 cm/sec.