Browse Prior Art Database

Snap-On Cap/Seal for MCM Module

IP.com Disclosure Number: IPCOM000038463D
Original Publication Date: 1987-Jan-01
Included in the Prior Art Database: 2005-Jan-31

Publishing Venue

IBM

Related People

Authors:
Courtney, MG [+details]

Abstract

In semiconductor devices large multichip modules (MCMs) frequently require the use of considerable space on the edge of the module to accomplish the sealed environment required for top surface metal features. Conventional approaches use metallic seals, and solder or braze material which is termally sealed. This article proposes a mechanically sealed joint which permits easier cap attachment or removal. The sketch in Fig. 1 shows a typical module with the substrate 1 and a C-4 (controlled-collapsed chip connector) 2 making the connection to the chip 3 which is surmounted with radial finger substrate by any number of methods, e.g., weld, braze, solder, epoxy. It is a ring which extends around the periphery of the module 5 (Fig. 2). Mating part B 7 (Fig 1) snaps into part A to effect the seal.