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Unitized Cap/Heatsink/Actuator Disclosure Number: IPCOM000038504D
Original Publication Date: 1987-Jan-01
Included in the Prior Art Database: 2005-Jan-31

Publishing Venue


Related People

Arnold, AJ [+details]


The drawings depict a module cap configured to serve as a comprehensive physical interface for an integrated circuit assembly. Principal functions include substrate reinforcement, connector engagement, heat transfer and protection of the module interior. These are achieved as follows: 1. A chip-joined substrate (shown separately) is seated within the cap with its top (chip-joined) surface resting against the seating ledge 1. Fixturization (not shown) is used to establish a precise relationship between the array of substrate I/O pins and the working surfaces provided on the cap. Bonding is accomplished by setting of an adhesive applied between the sidewalls of the substrate and the cap while the two are held in the fixture. 2.