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Design of "Fuse-Joint" for Glass-Ceramic Pin Attachment

IP.com Disclosure Number: IPCOM000038526D
Original Publication Date: 1987-Jan-01
Included in the Prior Art Database: 2005-Jan-31

Publishing Venue

IBM

Related People

Authors:
Kapur, S Palmateer, PH Shih, DY [+details]

Abstract

This article concerns the design of a frangible solder joint for bonding an I/O pin to a substrate made of low fracture material, such as glass-ceramic. Non-repairable ceramic failures resulting from the high stresses incurred during pin brazing operations are reduced or eliminated by employing the disclosed "fuse" joint. Ceramic tear-out under low externally applied stress is of primary concern following a glass-ceramic I/O pin brazing process in which pins are brazed onto metallized I/O substrate pads. Ceramic substrates can be saved from such non-repairable ceramic fractures by use of the low stressed, fail-safe, pin attachment structure here disclosed.