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Membrane Solder Seal/Membrane Epoxy Seal Disclosure Number: IPCOM000038541D
Original Publication Date: 1987-Jan-01
Included in the Prior Art Database: 2005-Jan-31

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DiPaolo, N Pasco, RW Wong, AC [+details]


In semiconductor processing, modules are manufactured wherein a hermetic seal is made between the cap and substrate. The seal is subjected to strains during thermal cycling because of the dissimilar materials from which the cap and substrate are made, and because of the different rates of heat transfer in the cap and substrate. This can result in defects. This invention proposes soldering (or use of epoxy adhesive) to affix a metallic membrane between the cap and the substrate, which would then become the seal. The membrane-seal would absorb most of the thermal strains to be experienced without the seal's being broken. The membrane may be manufactured from a solder-coatable material, such as Cu, Ni, Ni-plated Cu, Ni-plated INCONEL*, or a clad metal system.