Rework Tool for Surface-Mounted-Type Components
Original Publication Date: 1987-Feb-01
Included in the Prior Art Database: 2005-Jan-31
A process is described which utilizes condensation heating as the method of reflowing the solder connection for the purpose of replacing individual components on a surface-mounted circuit board. It operates at temperatures similar to the original manufacturing process; therefore, the components, flux, etc., are already qualified to withstand this process. The process employs the device, shown in the figure, which operates as follows: 1. A boiler 1 containing FC-70 is a type of Flournert produced by 3M Corporation. FC-70 or some similar heat transfer material, is heated to boil and provides a positive pressure. 2. During the reflow cycle the FC-70 vapor is released from the boiler through a control value 2 and a flexible hose to a reflow nozzle 3.