Cooling and Shielding Arrangement for Multilayer Card Assemblies With Cryptographic Functions
Original Publication Date: 1987-Feb-01
Included in the Prior Art Database: 2005-Jan-31
This article describes a combination heatsink and shield for printed circuit (PC) card assemblies with cryptographic functions which improves the transfer of heat to the ambient of any shielded multilayer assembly. PC card designers receive frequent requests to incorporate cryptographic capabilities into their card functions. The problem lies in the fact that this type of card requires tamper-proof shielding and is generally cooled by air. The devices in this type of assembly usually operate at a higher than normal temperature which, in turn, affects their reliability. In the arrangement disclosed herein, a combination shield and heatsink design uses two heat transfer modes to expel heat from the assembly. Fig. 1 shows the assembly in perspective view. Fig.