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Surface Solder Mounting Pad Geometry

IP.com Disclosure Number: IPCOM000038667D
Original Publication Date: 1987-Feb-01
Included in the Prior Art Database: 2005-Jan-31

Publishing Venue

IBM

Related People

Authors:
Hebert, TM Talkington, AL Thigpen, TE [+details]

Abstract

A surface solder attachment technique is described for attaching electronic modules to circuit cards. Surface solder devices are required to withstand many of the environmental conditions expected of the more traditional leaded (pin- in-hole (PIH)) technologies. One of the more severe conditions, to which assembled printed circuit cards are submitted, is the twisting or torque test. This test is designed to simulate the typical deflections that the card will see in actual use as it is plugged into its higher level package (mother board) or as other cards are plugged into it (daughter cards). As force is applied to the assembled card, it tends to deflect.