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Surface-Mountable Connected System Disclosure Number: IPCOM000038677D
Original Publication Date: 1987-Feb-01
Included in the Prior Art Database: 2005-Jan-31

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Hebert, TM Smith, FH [+details]


An improvement to the component mounting arrangement described in U.S. Patent 3,647,533 is described. The method of producing bonding bumps described in that print generally comprise the steps of: 1. affixing a patterned mask to the substrate onto which bonding bumps are to be placed, and 2. depositing metallic conductive material through the mask and onto the substrate. The general method encompasses a number of embodiments, particularly including: 1. the deposition of copper onto a conductive layer previously located on the substrate; 2.