Browse Prior Art Database

Gap Filling of Tfr Packaging and DTDI Chip

IP.com Disclosure Number: IPCOM000038696D
Original Publication Date: 1987-Feb-01
Included in the Prior Art Database: 2005-Jan-31

Publishing Venue

IBM

Related People

Authors:
Ouano, AC Goldblatt, RD [+details]

Abstract

The fabrication of certain high-performance semiconductor devices require the inclusion of deep trench dielectric isolation (DTDI) structures. These isolation structures have to be filled with a high temperature dielectric material that has excellent thermal stability, that is, a material which exhibits very little outgassing at temperature environments to at least 400ŒC. In advanced packaging devices, the selected material must be able to fill trenches or gaps between metal lines and the dielectric insulators. Of primary concern is the filling of those trenches and gaps that are less than 1 micrometer in width with an aspect ratio (height to width) of greater than 5. It has been determined that Pyraline 2560, a polyimide dielectric material manufactured by E.I. du Pont de Nemours & Co.