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Control Etch Profile in Ablative Photodecomposition by Optical Methods

IP.com Disclosure Number: IPCOM000038698D
Original Publication Date: 1987-Feb-01
Included in the Prior Art Database: 2005-Jan-31

Publishing Venue

IBM

Related People

Authors:
Braren, BE Rothenberg, JE Srinivasan, R [+details]

Abstract

Ablative photodecomposition (APD) is the rapid photodecomposition and etching of a material by the irradiation of the material with far ultraviolet (UV) light, via an effect which is not purely thermal and in which adverse thermal effects are not produced. Application of APD as a technology for the dry etching of polymer films depends greatly on the profile of the etch pattern that can be achieved. Optical methods can be used to allow the etch angle (which is always overcut) to vary from 0Œ to 33Œ. These results apply to free-standing films or films which are laid on surfaces which do not reflect or scatter the ultra (Image Omitted) violet light. In films on substrates which do not undergo etching (e.g., polyimide on ceramic), the etch profiles are similar but not exactly the same.