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Dry Process for Etching Ceramic

IP.com Disclosure Number: IPCOM000038768D
Original Publication Date: 1987-Mar-01
Included in the Prior Art Database: 2005-Feb-01

Publishing Venue

IBM

Related People

Authors:
Braren, B Leary-Renick, P Srinivasan, R [+details]

Abstract

Ceramics are widely used for packaging in many electronic systems. These ceramics can be dry-etched by a laser technique that allows through-hole and blind via patterning. This technique also can be used to facilitate changes in engineering for the removal of dielectrics from isolated planes in a ceramic, making it possible to reroute signal or power lines. The ceramic is ablated using UV wavelengths of sufficient energy fluence, for example, an Ar-F (193 nm) or Kr-F (248 nm) excimer laser. The process uses either a contact metal mask (Fig. 1) or projection printing (Fig. 2) which is particularly suitable for smaller patterns. With the availability of industrial size lasers, standard size modules can be patterned without using step-and-repeat-type processing.