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Lift-Off Process With Vertical Photoresist Edges

IP.com Disclosure Number: IPCOM000038793D
Original Publication Date: 1987-Mar-01
Included in the Prior Art Database: 2005-Feb-01

Publishing Venue

IBM

Related People

Authors:
Moritz, H [+details]

Abstract

When electrically charged (rather than neutral) particles are vapor deposited, the surfaces of the lift-off photoresist pattern will be repellently charged, preventing the resist edges from being coated during vapor deposition. Thus, there is no need for undercutting along those edges, so that the optimum lithographic resolution is available for the lift-off process. The new process will be described below with respect to the figure. The substrate to be subjected to vapor deposition is grounded. Vapor deposition is carried out by means of ionized metal atoms/molecules that are accelerated in the direction of the surfaces to be coated. As all metallized conductors are connected to the substrate, the impinging metal ions are attracted by the surfaces on which they are to be deposited.