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Programmable Power Planes for Multichip Modules

IP.com Disclosure Number: IPCOM000038948D
Original Publication Date: 1987-Mar-01
Included in the Prior Art Database: 2005-Feb-01

Publishing Venue

IBM

Related People

Authors:
Krouse, DR [+details]

Abstract

Packages for high I/O integrated circuit chips typically use multilayer ceramic substrates for chip carriers. These substrates contain signal planes for interconnecting chips in multichip packages and for connecting the chip I/O's with the package I/O's. They also contain continuous power planes for distributing power to each chip. Because certain electronic packages are designed to carry chips of different technology families on the same substrate, each chip may have different power requirements. A method of providing different power requirements is to divide the continuous power planes into segments, one segment for each required voltage for each chip. The required power is then connected to each segment and distributed to each corresponding chip. The method works as follows.