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Improved Adhesive Applicator for Surface-Mounted Components

IP.com Disclosure Number: IPCOM000038964D
Original Publication Date: 1987-Mar-01
Included in the Prior Art Database: 2005-Feb-01

Publishing Venue

IBM

Related People

Authors:
Koshy, R Stankus, JJ [+details]

Abstract

A method is described to improve the efficiency of the adhesive dispensing procedure for surface-mounted components (SMC). The technical and economic feasibility of the dual-sided surface- mount process depends on developing an efficient adhesive-dispensing technique. The present trend in using one head on the pick and place machine to dispense adhesive and the other head to place the components, is time consuming. The method, shown in Fig. 1, involves a procedure to integrate the adhesive application process within the pick and place operation. The new process involves the following steps: 1. Pick up the components. 2. Transport component to adhesive station. .IN 5 3.